Infineon Presents SOLID, A World First 3D Chip Integration Technology -?Chip-Sandwich? [Electronics]
Chip soldered together into stacks. 3um of solder is applied to the faces of the die, then they are combined with a bit of heat and pressure. This is contrasted with our 3D chip stacking, where we just glue stuff together and then drill and fill vias in a seperately.
Does the uneven interface cause any mechanical problems with SOLID? Or do they use large solder areas to ensure a good percentage coverage?
1:05:59 AM  Categories: Pushing rectangles...
|
